| Item | Description | Remark | |
| Rigid-flex PCB layer count | 2-14L | ||
| Flex Layer Count | 2-10L | ||
| Flex layer on outer or Middle Layer | Middle | ||
| Finished board thickness | 0.2-4.0mm | ||
| Tolerance of board thickness | >1.0mm, ±10% ≤1.0mm, ±0.1mm | ||
| Min. flex layer width | 2.5mm | ||
| Min. flex layer width between rigid layers | 3mm 2mm (limit) | ||
| Max. panel size | 406x736mm | ||
| Min. panel size | 10x15mm | ||
| Impedance tolerance | Single-ended: ±3Ω (≤50Ω), ±8% (>50Ω) Differential pair: ±4Ω (≤50Ω), ±8% (>50Ω) | ||
| Min. Twist & Warp | 0.75% (symmetrical); 1.5% (asymmetrical) | ||
| Adhesive dispense width | 1.5±0.5mm (slot width≥5mm)) | ||
| Min. distance between R-F connect area to conductors | 0.3mm (Half depth slot process) 0.5mm normal | ||
| Min. width of resin flow out in R-F connect area | 0.5mm 1.0mm normal | ||
| Min. distance between E-test pads | 3mil 4mil normal | ||
| Min. inner layer line width/space before compensation | Finished copper thickness18um | 3.5mil (partial3.2mil)/3mil (partial3mil) | |
| Finished copper thickness 35um | 3.5mil (partial3.2mil)/3.5mil (partial3mil) | ||
| Finished copper thickness 70um | 5.5mil (partial5mil)/4.5mil (partial4.2mil) | ||
| Inner layer grid | Finished copper thickness 18um | 5/5mil (after compensation) | |
| Finished copper thickness 35um | 6.5/5mil (after compensation) | ||
| Finished copper thickness 70um | 10/8mil (after compensation) | ||
| Min. Inner layer annual ring width (IPCIII, before compensation) | 4mil (≤6L), 8mil (7-11L), 12mil (≥12L) | ||
| Min. annual ring single side (laser hole, before compensation) | 3mil (partial 2.5mil) 4mil (partial 3.5mil) | ||
| Min. inner layer isolation strip width | 8 mil 10mil normal | ||
| Min. inner layer isolation annual ring width | 5mil (≤6L), 6mil (7-11L), 10mil (≥12L) | ||
| Max. inner layer finished copper thickness | 3oz | ||
| Min. distance between inner layer conductor and outline | 8 mil 10mil | ||
| Min. external layer line width/space before compensation (Rigid on top/bottom) | Finished copper thickness, before compensation | 4mil (partial3.0mil)/4mil (partial3.0mil) | |
| Finished copper thickness 35um, before compensation | 4mil (partial3.2mil)/4mil (partial3.0mil) | ||
| Finished copper thickness 70um, before compensation | 6mil (parital5.0mil)/6mil (partial4.5mil) | ||
| Min. external layer line width/space before compensation (Flex on top/bottom) | Finished copper thickness, before compensation | 6mil (partial4.5mil)/6mil (4.2mil) | |
| Finished copper thickness 35um, before compensation | 6mil (partial5.0mil)/6mil (partial4.5mil) | ||
| Finished copper thickness 70um, before compensation | 8.0mil (partial6.5mil)/ 8.0mil (partial5.5mil) | ||
| Min. annual ring for PTH in external layer (class II) | Finished copper thickness, before compensation | 4mil | |
| Finished copper thickness 35um, before compensation | 5mil | ||
| Finished copper thickness 70um, before compensation | 8mil | ||
| Min. annual ring for PTH in external layer (class III) | Finished copper thickness, before compensation | 5mil | |
| Finished copper thickness 35um, before compensation | 6mil | ||
| Finished copper thickness 70um, before compensation | 9mil | ||
| Min. gap between line and line on copper filling layer (before compensation) | 5/6mil (partial4/5mil) | ||
| Min. gaps between pad to line and pad to pad on copper filling layer (before compensation) | 5/5.5mil (partial4/4.5mil) | ||
| Min. gap between lines on resin filling layer (before compensation) | 5/6mil (partial4/5mil) | ||
| Min. gaps between pad to line and pad to pad on resin filling layer (before compensation) | 5/5.5mil (partial4/4.5mil) | ||
| Min. BGA pad size | 10mil (electrical Ni/Au7mil) 12mil (Electrical Ni/Au8mil) normal | ||
| Max. dry film tenting hole | 6.5mm 4.5mm normal | ||
| Min. distance between NPTH edge to external conductor before compensation | 6mil | ||
| Max. external finished copper thickness | 5 oz 4.5mm normal | ||
| Min. distance between external conductor and outline | 8mil 4.5mm normal | ||
| Min. external PTH annual ring single side, before compensation | <35um finished copper thickness | 4mil (<2mm); 6mil (2-4.5mm); 10mil (4.6-6.5mm) | |
| 35-70um finished copper thickness | 5mil (<2mm); 8mil (2-4.5mm); 14mil (4.6-6.5mm) | ||
| >70um finished copper thickness | 7mil (<2mm); 12mil (2-4.5mm); 18mil (4.6-6.5mm) | ||
| Drilling | Min. mechanical drill size | 0.15mm (≤1.6mm) 0.2mm (≤2.5mm) | |
| Min. half-hole (pth) size | 0.3mm | ||
| Laser blind via size | 4mil-6mil (advance6mil) | ||
| Max. buried hole size | 0.4mm | ||
| Max. drill hole size | 6.3mm | ||
| Max. A/R for through hole | 12:1 | ||
| Max. A/R for laser blind hole | 0.8:1 | ||
| Min. gap between hole wall and conductor before compensation | 5mil (≤6L), 6mil (7-11L), 10mil (≥12L) (after compensation) | ||
| Min. space between laser holes and conductor | 6mil | ||
| Min. tolerance of NPTH | ±3mil (limited+0, -6mil or +6mil, -0) | ||
| Slot drill bit diameter | 0.40-1.60mm (board thickness≤2.50mm) | ||
| Tolerance of countersink | ±0.3mm | ||
| Countersink hole size tolerance | ±0.3mm | ||
| Min. distance between PTH hole wall and rigid-flex connect area | 0.5mm (after compensation) | ||
| Min. distance between PTH holes | 10mil (after compensation) 12mil normal (after compensation) | ||
| Solder mask | Min. solder mask bridge (copper ≤1oz) | 4mil (Green, Red, Blue), 5mil (Black), 8.0mil (on big copper area) | |
| Min. solder mask bridge (copper 2-4oz) | 6mil,8mil (on big copper area) | ||
| Min. solder mask opening larger than pad single side | 4mil (partial 2mil) | ||
| Min. solder mask opening lsrger than NPTH hole signle side | 4mil | ||
| Min. width of soldermask cover line (singleside) | 4mil (partial1.5mil) | ||
| Max. finished hole size for via filled with Soldermask both side tenting | 0.9mm | ||
| Max. solder mask plugging via in pad with both sides opening | 0.55mm | ||
| Solder mask color | Green/matte green/Black/Blue/Red/White | ||
| Silk screen color | white/yellow/black | ||
| Carbon ink | Carbon thickness | NA | |
| Min. gap between carbon pads | 15mil | ||
| Min. gap between carbon and pads | 10mil | ||
| Carbon pad larger than covering pad single side | 4mil | ||
| Peelable mask | thickness | 0.2-0.8mm 0.2-0.5mm normal | |
| Outline | Min. space between the central line of non-copper-exposed V-cut to internal/external circuits (H means board thickness) | H≤40mil: 12mil (20°mean V-cut angle),13mil (30°),14.6mil (45°) | |
| 40 | |||
| 63 | |||
| 94.5 | |||
| V-cut offset tolerance | ±4mil | ||
| V-cut board thickness | 0.4-3.2mm ≤0.6mm one side V-cut | ||
| Tolerance of V-cut angle | ±5° | ||
| V-cut angle | 20°, 30°, 45° | ||
| Gold finger bevelling angle | 20°, 30°, 45°, 60° | ||
| Gold finger bevelling tolerance | ±5° | ||
| Gold finger bevelling remained thickness tolerance | ±5mil | ||
| Min. distance between gold finger and tab | 7mm | ||
| Min. gap between the side of gold finger and the outline edge line | 8mil | ||
| Min. internal radius | 0.3mm | ||
| Depth tolerance of depth-control groove milling | ±0.10mm | ||
| Outline tolerance | ±0.1mm | ||
| Rout slot tolerance (NPTH) | ±0.10mm | ||
| Rout slot tolerance (PTH) | ±0.13mm | ||
| Drill slot tolerance (NPTH length/width≥2) | ±0.05mm | ||
| Drill slot tolerance (PTH length/width≥2) | ±0.075mm | ||
| Drill slot tolerance (NPTH length/width<2) | ±0.075mm | ||
| Drill slot tolerance (PTH length/width<2) | ±0.1mm | ||
| The tolerance between Fiducial mark pad to Fiducial mark pad | ≤300mm ±4mil 300-400mm ±5mil 400-500mm ±6mil >500mm ±7mil | ||
| IPC Class 3 | Yes | ||
| Certification | ISO 9001 | Yes | |
| UL number | Yes | ||
Tel:1-888-PCB-9518 or 1-888-722-9518
Email:sales@goldphoenixpcb.biz,
goldphoenixtech@yahoo.ca
Copyright Gold Phoenix PCB Co., Ltd. 2011 - 2016