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Home > Capabilities > Rigid PCB Capacity
ItemDescription
Layer1- 20Layers (FR- 4, FR- 406, 370 HR)
1- 2Layers (Rogers, Aluminum/ Copper Base, TEFLON)
MaterialFR- 4, FR- 406, 370 HR; Rogers4003; Rogers4350
Aluminum and Copper base;Teflon
Finish ThicknessFinish Thickness: 0.008" - 0.275" (0.2mm- 7mm)
Min Thickness2- layer: 0.008" (0.2mm)
4- layer: 0.016" (0.4mm)
6- layer: 0.024" (0.6mm)
8- layer: 0.032" (0.8mm)
10- layer: 0.04" (1mm)
More than 10layers (0.5Xnumber of layers X0.008")
Surface FinishingLead Finishing: HASL, HASL+Gold finger
Lead- free Finishing: Lead- free HASL, ENG Gold; OSP, Immersion silver
Special ProcessImpedance board (request as±10%)
High TG / halogen- free/ / halogen- free & High TG board
Min Trace
Width / Min Clearance

Inner Layers        Outer Layers

0.5oz: 2.5/ 2.5mil      1/ 3oz- Hoz: 3/ 3mil

1oz: 3/ 3mil         1oz: 3.5/ 3.5mil

2oz: 5/ 7mil         2oz: 5/ 7mil

3oz: 7/ 8mil         3oz: 7/ 8mil

4oz: 10/ 10mil     4oz: 10/ 10mil

5oz: 12/ 12mil     5oz: 12/ 12mil

6oz: 15/ 12mil     6oz: 15/ 12mil


Remark



Aspect RatioMin Hole Size 6mil
Min Hole Ring

Inner:                     Outer:

0.5oz: 4mil             1/ 3oz -0.5oz: 4mil

1oz: 5mil                1oz: 4mil

2oz: 6mil                2oz: 6mil

3oz: 9mil                3oz: 9mil

4oz: 12mil              4oz: 12mil

5oz: 15mil              5oz: 15mil

6oz: 17mil              6oz: 17mil

Copper ThicknessInner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz
Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz
Standard Stack Up  4- layer:
Enlarge
  6- layer:
Enlarge
  8- layer:
Enlarge
10- layer:
Enlarge
Min Hole Size and ToleranceMin Finish Hole: 6mil
Hole Tolerance: ±3mil
Thickness of Plating Layer

HASL: Copper Thickness: 20um -35um Tin 5 -20um

Immersion Gold: Nickel 100u" -200 u" Gold 2u" -4u"

Hard Plated Gold: Nickel 100u" -200 u" Gold 4u" -8u"

Golden Finger: Nickel : 100u" -200 u" Gold : 5u" -15u"

Immersion Silver: 6u" -12u"

OSP: Film 8u" -20u"

Solder Mask ColorGlossy: Green, Black, Red, Yellow, White, Purple, Blue Matt: Green, Black
Solder Mask Resolution

Solder Mask Thickness: 0.2mil -1.6mil

Solder Dam: Green 7mil /Other Color 8mil

Solder Mask Hole Plug Diameter: 10mil -25mil

Silk Screen ColorWhite, Black
Profile

Punch Tol: ±5mil

CNC Tol: ±5mil

V- CUT Tol: ±10mil

Bevel Edge: ±5mil

Slot Min: 32mil

Angel: 15°, 20°, 30°, 45°, 60°

Bow and TwistSMT≤0.75%
None SMT≤1%
Accept StandardIPC Class 2; IPC Class 3; ISO9000
×  
4-layer
×  
6-layer
×  
       
8-layer
×  
10-layer
ItemDescriptionRemark
Layer1- 20Layers (FR- 4, FR- 406, 370 HR)
1- 2Layers (Rogers, Aluminum/ Copper Base, TEFLON)

MaterialFR- 4, FR- 406, 370 HR; Rogers4003; Rogers4350
Aluminum and Copper base;Teflon

Finish ThicknessFinish Thickness: 0.008" - 0.275" (0.2mm- 7mm)
Min Thickness2- layer: 0.008" (0.2mm)
4- layer: 0.016" (0.4mm)
6- layer: 0.024" (0.6mm)
8- layer: 0.032" (0.8mm)
10- layer: 0.04" (1mm)
More than 10layers (0.5Xnumber of layers X0.008")

Surface FinishingLead Finishing: HASL, HASL+Gold finger
Lead- free Finishing: Lead- free HASL, ENG Gold; OSP, Immersion silver

Special ProcessImpedance board (request as±10%)
High TG / halogen- free/ / halogen- free & High TG board

Min Trace
Width / Min Clearance

Inner Layers(trace width/clearance)

0.5oz: 2.5/ 2.5mil

1oz: 3/ 3mil

2oz: 5/ 7mil

3oz: 7/ 8mil

4oz: 10/ 10mil

5oz: 12/ 12mil

6oz: 15/ 12mil

Outer Layers(trace width/clearance)

1/ 3oz- Hoz: 3/ 3mil

1oz: 3.5/ 3.5mil

2oz: 5/ 7mil

3oz: 7/ 8mil

4oz: 10/ 10mil

5oz: 12/ 12mil

6oz: 15/ 12mil

Partial 3mil line width and 4mil clearance is allowed
Aspect RatioMin Hole Size 6mil
Min Hole Ring

Inner:

0.5oz: 4mil

1oz: 5mil

2oz: 6mil

3oz: 9mil

4oz: 12mil

5oz: 15mil

6oz: 17mil

Outer:

1/ 3oz -0.5oz: 4mil

1oz: 4mil

2oz: 6mil

3oz: 9mil

4oz: 12mil

5oz: 15mil

6oz: 17mil


Copper ThicknessInner: H0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz. 6oz
Outer: 1/ 3oz, 0.5oz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz

Standard Stack Up  4- layer:
Enlarge
  6- layer:
Enlarge
  8- layer:
Enlarge
10- layer:
Enlarge

Min Hole Size and ToleranceMin Finish Hole: 6mil
Hole Tolerance: ±3mil

Thickness of Plating Layer

HASL: Copper Thickness: 20um -35um Tin 5 -20um

Immersion Gold: Nickel 100u" -200 u" Gold 2u" -4u"

Hard Plated Gold: Nickel 100u" -200 u" Gold 4u" -8u"

Golden Finger: Nickel : 100u" -200 u" Gold : 5u" -15u"

Immersion Silver: 6u" -12u"

OSP: Film 8u" -20u"


Solder Mask ColorGlossy: Green, Black, Red, Yellow, White, Purple, Blue Matt: Green, Black
Solder Mask Resolution

Solder Mask Thickness: 0.2mil -1.6mil

Solder Dam: Green 7mil /Other Color 8mil

Solder Mask Hole Plug Diameter: 10mil -25mil


Silk Screen ColorWhite, Black
Profile

Punch Tol: ±5mil

CNC Tol: ±5mil

V- CUT Tol: ±10mil

Bevel Edge: ±5mil

Slot Min: 32mil

Angel: 15°, 20°, 30°, 45°, 60°


Bow and TwistSMT≤0.75%
None SMT≤1%

Accept StandardIPC Class 2; IPC Class 3; ISO9000

Get in touch

Tel:1-888-PCB-9518 or 1-888-722-9518
Email:sales@goldphoenixpcb.biz,
goldphoenixtech@yahoo.ca

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