| Item | Description | Capacity |
| 1 | Single and double sided SMT/PTH | Yes |
| 2 | Large parts on both sides, BGA on both sides | Yes |
| 3 | Smallest Chips size | 0201 |
| 4 | Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| 5 | Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| 6 | Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| 7 | Assembly surface mount connectors | Yes |
| 8 | Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes,Assembly by hands |
| 9 | Wave soldering | Yes |
| 10 | Max PCB size | 14.5 in. x 19.5 in. |
| 11 | Min PCB Thickness | 0.02 |
| 12 | Fiducial Marks | Preferred but not required |
| 13 | PCB Finish: | 1.SMOBC/HASL 2.Electrolytic gold 3.Electroless gold 4.Electroless silver 5.Immersion gold 6.Immersion tin 7.OSP |
| 14 | PCB Shape | Any |
| 15 | Panelized PCB | 1.Tab routed 2.Breakaway tabs 3.V-Scored 4.Routed+ V scored |
| 16 | Inspection | 1.X-ray analysis 2.Microscope to 20X |
| 17 | Rework | 1.BGA removal and replacement station 2.SMT IR rework station 3.Thru-hole rework station |
| Item | Description | Capacity |
| 1 | Single and double sided SMT/PTH | Yes |
| 2 | Large parts on both sides, BGA on both sides | Yes |
| 3 | Smallest Chips size | 0201 |
| 4 | Min BGA and Micro BGA pitch and ball counts | 0.008 in. (0.2mm) pitch, ball count greater than 1000 |
| 5 | Min Leaded parts pitch | 0.008 in. (0.2 mm) |
| 6 | Max Parts size assembly by machine | 2.2 in. x 2.2 in. x 0.6 in. |
| 7 | Assembly surface mount connectors | Yes |
| 8 | Odd form parts: LED Resistor and capacitor networks Electrolytic capacitors Variable resistors and capacitors (pots) Sockets | Yes,Assembly by hands |
| 9 | Wave soldering | Yes |
| 10 | Max PCB size | 14.5 in. x 19.5 in. |
| 11 | Min PCB Thickness | 0.02 |
| 12 | Fiducial Marks | Preferred but not required |
| 13 | PCB Finish: | 1.SMOBC/HASL 2.Electrolytic gold 3.Electroless gold 4.Electroless silver 5.Immersion gold 6.Immersion tin 7.OSP |
| 14 | PCB Shape | Any |
| 15 | Panelized PCB | 1.Tab routed 2.Breakaway tabs 3.V-Scored 4.Routed+ V scored |
| 16 | Inspection | 1.X-ray analysis 2.Microscope to 20X |
| 17 | Rework | 1.BGA removal and replacement station 2.SMT IR rework station 3.Thru-hole rework station |
Tel:1-888-PCB-9518 or 1-888-722-9518
Email:sales@goldphoenixpcb.biz,
goldphoenixtech@yahoo.ca
Copyright Gold Phoenix PCB Co., Ltd. 2011 - 2016