This Gold Phoenix PCB Knowledge Center article explains the various
types of PCB pads, including common pad designs and special pad
structures used in printed circuit board manufacturing and assembly.
1. Common Pads
1.1 Square Pads
Square pads are often used when components on the printed board are
large and few, and the printed wires are simple. They are also easy to
implement during manual PCB production.
1.2 Circular Pads
Circular pads are widely used in single-sided and double-sided printed
boards with regularly arranged components. When board density allows, a
larger pad size can improve soldering reliability.
1.3 Island-Shaped Pads
Island-shaped pads integrate the connection between pads and are
commonly used for vertically arranged or irregular installation designs.
1.4 Polygonal Pads
Polygonal pads are used to distinguish pads with similar outer diameters
but different apertures, helping with processing and assembly.
1.5 Oval Pads
Oval pads provide sufficient area to improve resistance to pad stripping
and are often used with dual in-line devices.
1.6 Open-Shaped Pads
Open-shaped pads are designed to help ensure that pad holes used for
manual repair welding are not blocked by solder after wave soldering.
2. Special Pads
2.1 Plum Blossom Pads
Plum blossom pads are commonly used where large vias are connected to
ground. This design can help maintain grounding performance and reduce
solder blockage risks during reflow soldering.
2.2 Cross-Shaped Pads
Cross-shaped pads are also called thermal pads or hot air pads. Their
function is to reduce heat dissipation from pads during soldering and
help prevent soldering issues caused by excessive heat transfer.
When connected to ground, the cross-shaped structure can reduce the
copper connection area and slow heat dissipation, making soldering
easier.
For reflow soldering processes, this pad design can help reduce issues
caused by uneven thermal behavior.
2.3 Teardrop Pads
Teardrop pads are often used when traces connected to pads are thin.
They help reduce the risk of pad peeling and trace disconnection, and
are commonly used in high-frequency circuit designs.
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