Characteristics and Structure of Metal‑Core PCB & Aluminum PCB

This Gold Phoenix PCB Knowledge Center article describes key characteristics and internal structure of metal‑core PCB and aluminum PCB.

The characteristics of the metal‑core PCB / Aluminum PCB

1. Aluminum PCB supports SMT assembly processes.

2. Delivers effective thermal diffusion performance within circuit design.

3. Reduces component operating temperature, improves power density and overall reliability, and extends end‑product service life.

4. Enables smaller product form‑factors while lowering hardware and assembly‑related costs.

5. Offers improved mechanical durability as an alternative to brittle ceramic PCB substrates.

The structure of the metal‑core PCB / Aluminum PCB

Aluminum‑base copper‑clad laminate (CCL) serves as base raw‑material for metal‑core PCBs. It is composed of copper foil, thermal‑insulation dielectric layer and metal substrate, forming a three‑layer construction:

Circuit Layer: Comparable to copper‑clad material used for conventional PCBs. Copper foil thickness ranges from 1 oz to 10 oz.

Dielectric Layer: A material combining electrical insulation and low thermal‑resistance properties. Its thickness ranges from 0.003 " to 0.006 ", and represents the core technical component of aluminum‑base CCL. Relevant materials can achieve UL certification.

Base Layer: Acts as the metal core substrate; aluminum‑base or copper‑base materials are commonly deployed.