Epoxy and PU Resins for Potting and Encapsulation of PCBA

This Gold Phoenix PCB Knowledge Center article explains epoxy and polyurethane (PU) resins for potting and encapsulation of PCBA, including their properties, differences, and selection criteria.

Epoxy and polyurethane resins are excellent insulators against aggressive environments and contribute to the mechanical protection of the PCBs.

Epoxy resins and polyurethane are used for protection in thickness. These systems generally consist of two liquid components that, when mixed, increase quickly in viscosity until fully cured. They are designed to protect and insulate the printed circuit board components against harsh environments: moisture, vibration, mechanical and thermal shocks. The resins offer a total protection of the printed circuit and allow through the deposited thickness of the subset to work completely immersed in water, solvent, gas …

Polyurethane Resin

More flexible and less stress on components PCB during curing. They cure more quickly and are more resistant to abrasion.

Epoxy Resin

Temperature resistance is higher compared to polyurethane resins. They are generally harder and offer better adhesion and excellent resistance to chemical environments.

How to Choose a Resin?

To choose the most appropriate resin, it is important to clearly define your needs:

• Norms

• Environment

• Repairability (y/n)

• Electrical Characteristics

• Method of application

• Operating temperature