PCB Knowledge Center & Technical Articles

2021-05-17What You Need to Know About PCB Assembly | Gold Phoenix PCB
Summary:Learn about PCB assembly — PCBA terminology, through-hole assembly, surface mount technology, and mixed technology explained.
2021-02-03PCB Panelization Methods & Design Guide | Gold Phoenix PCB
Summary:PCB panelization methods explained — V-CUT, punching slot, and stamp hole, plus key design considerations for successful panelization.
2021-02-02Coin Insertion Technology for PCB Thermal Management | Gold Phoenix PCB Knowledge Center
Summary:Learn how PCB coin insertion technology supports thermal management using embedded T-Coin, I-Coin, and C-Coin solutions, including the embedding process and embedding-versus-burying trade-offs.
2021-01-29OSP Technology Introduction | Gold Phoenix PCB
Summary:Learn about OSP PCB surface treatment, its process, benefits, coating thickness, and common OSP defects.
2021-01-12Metal-Core PCB & Aluminum PCB Structure | Gold Phoenix PCB
Summary:MCPCB / aluminum PCB three-layer structure: circuit layer, dielectric layer, and metal base.
2021-01-05Avoid PCB Layout Defects in ISM-RF Products
Summary:How to avoid PCB layout defects in ISM-RF products — inductor orientation, lead coupling, ground vias, trace length, and grounding.
2020-12-304 Basic Features of PCB RF Circuits | Gold Phoenix PCB
Summary:Four basic PCB RF circuit features covering RF interfaces, weak signals, interference, adjacent-channel effects, and shielded cavity design.
2020-12-21Flying Probe Test Guide: Definition, Working Principle, Advantages & Disadvantages | Gold Phoenix PCB Knowledge Center
Summary:Learn what a flying probe test is, how flying probe testers work with X-Y probes and CAD data, and the main advantages and disadvantages for PCB fabrication and assembly.
2020-12-15PCB Bow & Twist Prevention | Gold Phoenix PCB
Summary:PCB bow and twist prevention: IPC-6012 limits, balanced copper distribution, and symmetrical stack-up guidance.
2020-12-04RF PCB Layout & Wiring Guidelines | Gold Phoenix PCB
Summary:RF PCB layout and wiring guidelines covering component placement, RF trace routing, grounding, copper foil, and 3W spacing rules.
2020-12-02PCB Safety Clearance Design Rules | Gold Phoenix PCB
Summary:PCB safety clearance design rules covering trace and pad spacing, IPC 2221 guidance, the 3W rule, and electrical and non-electrical safety clearances.
2020-11-23Flexible Substrate: Uses & Benefits | Gold Phoenix PCB
Summary:Learn what a flexible substrate is, how it is used in PCBs, key applications (automotive, electronics, medical), and benefits (weight, reliability, heat, cost).
2020-11-20Counterbore vs. Countersink in PCBs | Gold Phoenix PCB
Summary:Counterbore vs countersink in PCB fabrication: hole shapes, chamfer angles (82°, 90°, 100°), fastener fit and a side-by-side comparison table.
2020-11-18PCB Hard Gold Plating: Thickness & Applications | Gold Phoenix PCB
Summary:Hard gold plating: thickness, gold fingers and contact pads, plus key advantages and limitations.
2020-11-15PCB Scoring Guidelines: V-Score Rules | Gold Phoenix PCB
Summary:Follow common PCB scoring (V-score) guidelines — score depth, web thickness, thin/thick board rules, array design, and keep-out spacing for designers.
2020-10-27Single-Layer vs. Multi-Layer PCBs | Gold Phoenix PCB
Summary:Compare single-layer vs. multi-layer PCBs — construction, vias, pros/cons, and applications from coffee makers to smartphones and medical devices.
2020-10-25Types of Vias in PCB Design: Through-Hole, Via-in-Pad, Microvia | Gold Phoenix PCB
Summary:Learn about PCB vias — through-hole, via-in-pad, and microvia — including their characteristics, advantages, and how to choose the right via type.
2020-10-19Flex PCB Stiffener Materials: FR4, Polyimide and Metal
Summary:Learn flex PCB stiffener materials including FR4, polyimide, stainless steel and aluminum, with typical thicknesses, bonding methods and applications.
2020-10-13PCB Gold Finishes: ENIG, ENEPIG & Gold Fingers | Gold Phoenix PCB
Summary:Understand gold PCB surface finishes — ENIG, ENEPIG, and gold fingers — including gold purity, plating thickness, costs, and applications.
2020-09-22PCB Plug Via Process | Gold Phoenix PCB
Summary:This Gold Phoenix PCB article explains the PCB plug via process and related via fabrication methods, including their pros, cons, and reliability considerations.
2020-09-21PCB OSP Surface Finish Guide | Gold Phoenix PCB
Summary:Learn about PCB OSP surface finish—manufacturing process, advantages, storage requirements, and post-solder problems. Covers micro-etching and DI rinse.
2020-09-20Flex PCB Stiffener Requirements: Design Drawing Guide
Summary:Learn how to specify flex PCB stiffeners in design drawings, including FR4, polyimide and metal materials, ZIF requirements, PTH clearance and adhesives.
2020-09-18Impedance Control PCB Design Guide | Gold Phoenix PCB
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2020-09-04Flex PCB Stiffeners: Materials & Design Benefits | Gold Phoenix PCB
Summary:Learn how polyimide, FR4, aluminum and stainless steel stiffeners support flex PCB connectors, ZIF areas, thermal management and controlled bending.
2020-09-01PCB Market Outlook & Trends | Gold Phoenix PCB
Summary:Explore the PCB market outlook—HDI, high-power boards, IoT, flex PCBs, high-speed PCBs, 3D printing, and biodegradable PCBs shaping the future of PCBs.
2020-08-25PCB Surface Finishes: Pros and Cons | Gold Phoenix PCB
Summary:Compare PCB surface finishes — HASL, OSP, ENIG, Immersion Tin, and Hard Gold. Their advantages, disadvantages, and best applications.
2020-08-24PCB Temperature: Managing Heat | Gold Phoenix PCB
Summary:Learn PCB temperature monitoring, heat limits (FR-4 135°C, high-temp 150°C), and 9 techniques to prevent overheating—heat sinks, fans, laminates, CTE alignment.
2020-08-24Rigid-Flex PCB vs. Flex PCB with FR-4 Stiffener: Key Differences | Gold Phoenix PCB
Summary:This Gold Phoenix PCB Knowledge Center article explains the differences between rigid-flex PCB and rigidized flex construction (flex PCB with FR-4 stiffener) across six aspects: definition, circuit design, connection, production, cost, and application.
2020-08-14Via-in-Pad for Rigid-Flex PCB: Blind and Buried Vias
Summary:Learn via-in-pad design for rigid-flex PCBs, including no-flow prepreg, lamination cycles, blind and buried via stackups, aspect ratio and via fill.
2020-07-27Panel-Plating Blind-Hole Filling for HDI PCBs
Summary:Learn panel-plating blind-hole filling for HDI PCBs, including super filling principles, process comparisons and blind and buried hole applications.
2020-07-24Via Tenting vs Filling vs Plugging | Gold Phoenix PCB
Summary:Understand PCB via tenting, LPI via filling, conductive and non-conductive via plugging, Via in Pad applications, benefits, limitations and process steps.
2020-07-19Flex Circuit with Stiffeners vs. Rigid-Flex PCB: Design Comparison | Gold Phoenix PCB
Summary:This Gold Phoenix PCB Knowledge Center article compares flex circuits with stiffeners and rigid-flex PCBs across IPC definitions, functionality, cost, materials, and design considerations.
2020-07-12PCB Cover Copper Technique: Design Guide | Gold Phoenix PCB
Summary:Learn PCB cover copper (copper pour) technique—purpose, large copper vs grid copper, and 9 key design points for grounding, crystal oscillator, and dead zones.
2020-07-11PCB Layer Stackup Guide: 2 to 10 Layers | Gold Phoenix PCB
Summary:PCB layer stackup capabilities — purpose, advantages, and configurations for 2, 4, 6, 8, and 10-layer boards.
2020-07-08QFN PCB Design Guidelines: Footprint, Mask & Stencil | Gold Phoenix PCB
Summary:Learn QFN PCB design guidelines for footprint dimensions, thermal vias, solder mask clearances, stencil thickness, aperture ratios and solder paste coverage.
2020-06-27Dynamic Flex PCB Design: Bend Radius, Copper and EMI
Summary:Learn key dynamic flex PCB design rules, including minimum bend radius, RA copper grain direction, layer count, neutral bend axis and EMI shielding.
2020-06-20PCB Conformal Coating Types and Thickness | Gold Phoenix PCB
Summary:Learn PCB conformal coating types, curing methods, protective functions, and IPC J-STD-001 thickness requirements for acrylic, silicone and other coatings.
2020-06-19Surface Mount Assembly Procedure of PoP Components
Summary:Surface mount assembly procedure for PoP components: Standard/TMV structures, SMT techniques, solder paste printing, dipping, reflow soldering, inspection.
2020-06-19PCB Design for Planes, Aerospace and Military Applications
Summary:Learn about PCB design for planes, aerospace, and military applications, including robust layouts, thermal management, high-frequency RF, mill-spec components, impedance control, and current cushion requirements.
2020-06-08PCB Panelization Guidelines & Methods | Gold Phoenix PCB
Summary:PCB panelization guidelines — V-score, tab routing, and solid tab methods with design considerations and breakout instructions.
2020-06-01Bare Board Testing: PCB Continuity and Isolation
Summary:Learn when to use bare board testing, how continuity and isolation tests work, and the differences between pinned fixture and flying probe testing.
2020-05-27Decoupling Capacitor Via Design and Loop Inductance
Summary:Learn how via placement and multiple-via configurations affect decoupling loop inductance between capacitors and PCB power and ground planes.
2020-05-17Stiffener of Flex PCB: Materials, Design Guide | Gold Phoenix PCB
Summary:Learn about flex PCB stiffeners — when to use them, materials like FR-4 and polyimide, and how to design stiffeners for flexible circuits.
2020-05-10PCB Test Points: Purpose, Benefits and DFT Design
Summary:Learn the purpose of PCB test points, their DFT benefits, common probe access methods, spacing requirements and placement considerations.
2020-05-09PCB Technical Rails: Design, Use and Depaneling
Summary:Learn what PCB technical rails are, when they are needed for assembly, key design considerations, cost impact and common depaneling methods.
2020-05-07Epoxy vs PU Resin for PCBA Potting and Encapsulation
Summary:Compare epoxy and polyurethane resins for PCBA potting and encapsulation, including flexibility, adhesion, chemical resistance and operating temperature.
2020-04-27What Can Damage Flexible Printed Circuit Boards | Gold Phoenix PCB
Summary:Learn environmental and manufacturing‑handling factors that can cause damage to flexible PCBs, including moisture, static, dust, temperature, chemical exposure and design‑related failures.
2020-04-24QFN Package Guide: Types, Thermal Design and Bonding
Summary:Learn QFN package construction, wire bond vs flip chip, leadframes, thermal and electrical behavior, bonding diagrams, marking and die attach.
2020-04-23Flex-Rigid PCB Manufacturing: Materials and Processes
Summary:Learn flex-rigid PCB materials and manufacturing processes, including polyimide, PTFE, traditional flex-rigid construction and embedded flexible circuits.
2020-04-23FPC Base Materials: Adhesive vs Adhesiveless Laminates
Summary:Learn FPC base materials, including adhesive and adhesiveless laminates, RA vs ED copper, polyimide thicknesses and common flex constructions.
2020-04-10PCB Conformal Coating: Protection Guide | Gold Phoenix PCB
Summary:Conformal coating on PCBs — what it is, why it matters for moisture and pollutant protection, and how to prepare for it in PCB design.
2020-03-30PCB DFM: Reduce Cost and Improve Reliability | Gold Phoenix PCB
Summary:Learn how PCB Design for Manufacturability (DFM) helps prevent production issues, reduce avoidable cost, improve reliability, and shorten manufacturing cycle time.
2020-03-21PCB Stack-Up: EMC Design and Layers | Gold Phoenix PCB
Summary:PCB stack-up design for EMC — four key factors, five design objectives, signal/plane coupling, and symmetry requirements.
2020-03-21PCB Assembly (PCBA) Process | Gold Phoenix PCB
Summary:This in-depth guide covers the complete printed circuit board assembly (PCBA) process, including PCB base layers, rigid/flex/metal core PCB types, SMT & THT mounting, and pre-manufacturing DFM checks.
2020-03-03Printed Circuit Board Solderability Issues | Gold Phoenix PCB
Summary:Learn how to troubleshoot PCB solderability issues by checking date codes, storage conditions, surface finish contamination, HASL de-wetting, solder paste, and flux changes.
2020-02-28Q&A About SMT Assembly | Gold Phoenix PCB
Summary:SMT assembly Q&A: equipment, attributes, THT differences, solder paste printing, chip mounting, reflow soldering, inspection, and workshop requirements.
2020-02-24The Benefits of Prototyping PCBs | Gold Phoenix PCB
Summary:This Gold Phoenix PCB Knowledge Center article explains the benefits of PCB prototyping, covering prototype types, reduced timelines, manufacturing review, accurate testing, individual component testing, and cost reduction.
2019-09-21Aluminum PCB Guide: Structure and Manufacturing | Gold Phoenix PCB
Summary:Learn the structure, thermal performance, classifications, and key manufacturing considerations of aluminum PCBs, including thick copper etching and solder mask processing.
2019-09-07Knowledge of FPC Surface Plating | Gold Phoenix PCB
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2019-08-31PCB Solder Bridges: Causes and Prevention | Gold Phoenix PCB
Summary:Learn what causes PCB solder bridges and how proper lead length, hole and pad sizing, solder mask, spacing, and fiducials can reduce bridging risk.

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